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Deadline for Hot Interconnects 2001 Paper Submission Is Fast Approaching!

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  • Zhi-Li Zhang
    We apologize if you receive multiple copies. ============================================== CALL FOR PAPERS HOT INTERCONNECTS 9 A Symposium on High Performance
    Message 1 of 1 , Apr 4, 2001
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      We apologize if you receive multiple copies.

      ==============================================

      CALL FOR PAPERS

      HOT INTERCONNECTS 9
      A Symposium on High Performance Interconnects

      Memorial Auditorium, Stanford University, Aug. 22-24, 2001

      (Sponsored by the IEEE Computer Society)

      http://www.hoti.org

      Hot Interconnects is an international symposium focusing on the hardware
      and software architecture and implementation of high-performance
      interconnects of all scales. Its themes include cross-cutting issues
      spanning computer systems and networking technologies for providing
      universal services over packet networks. Examples of relevant topics
      include network-attached storage, transport of voice and video over
      packet networks, high-performance network interfaces, novel switching
      and routing technologies capable of providing differentiated services,
      plug-and-play network interfaces, and active network architectures. The
      conference is directed particularly at new and exciting product and
      technology innovations in these areas. Contributions should focus on
      real products, prototypes, or experimental systems and their performance
      evaluation. In addition to those subscribing to the main theme of the
      conference, contributions are also solicited on the following topics:

      - Gb/sec and Tb/sec switching and routing technologies
      - High-speed packet processing engines
      - Serial link technologies
      - xDSL, HFC, and wireless access technologies
      - Mobility-enabling technologies
      - Seamless appliance interconnectivity
      - Network-attached storage devices and interfaces
      - Video and voice over packet networks
      - Wireless and mobile network interfaces
      - Network security
      - Next-generation networking chip sets
      - Network protocols on a chip
      - Low-power networking and interconnect technologies
      - Network appliance technologies
      - Optical Interconnects

      Submission Guidelines:
      ---------------------------------
      Submissions must be in the form of extended summaries and should not
      exceed 5 pages (double-column format). The summary should have
      sufficient technical detail to judge its quality and suitability for
      presentation at the conference. Guidelines for submission are available
      at http://www.hoti.org
      Inquires about the conference should be directed to the TPC chairs.


      Important Dates:
      -----------------------
      - Submission deadline: April 15, 2001.
      - Notification of acceptance: May 15, 2001.
      - Camera-ready due: July 1, 2001.


      Organizing Committee:
      ---------------------------------
      - General Chair: Fred Bauer, Nokia (fred@...)

      - Technical Program Chairs:
      - Marwan Krunz, University of Arizona (krunz@...)
      - John Lockwood, Washington University in St. Louis
      (lockwood@...)

      - Tutorial/Panel: Ibrahim Matta, Boston University (matta@...)

      - Treasurer: Melanie Swan, MS Financial Consulting
      (melanie.swan@...)

      - Registration: Bob Wedig, Wedig Consulting (bob@...)

      - Webmaster: Raymond Lee, IP Dynamics (raymondl@...)

      - Local arrangements: Liz Rogers, Liz Rogers Design
      (liz@...)

      - Publicity: Zhi-Li Zhang, University of Minnesota (zhzhang@...)

      Technical Program Committee:

      Anujan Varma, University of California Santa Cruz
      Balaji Prabhakar, Stanford University
      Dan Pitt, Nortel Networks
      Ian Akyildiz, Georgia Institute of Technology
      James Yee, Pacific Broadband
      Peter Newman, Ensim
      Zhi-Li Zhang, University of Minnesota
      Nina Taft, Sprint Labs
      Christopher Diot, Sprint Labs
      George Apostolopoulos, Reback Networks
      Andrew Cambell, Columbia University
      Parameswaran Ramanathan, University of Wisconsin
      Mohan Kumar, University of Texas at Arlington
      Ron Srodawa, Oakland University
      James P.G. Sterbenz, BBN
      Edward Knightly, Rice University
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